Packaging technologies for high temperature control electronics
نویسندگان
چکیده
منابع مشابه
Packaging Technologies for High Temperature Electronics and Sensors
This paper reviews ceramic substrates and thick-film metallization based packaging technologies in development for 500°C silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-...
متن کاملHigh Temperature Electronics Packaging
Materials and processes are being developed for packaging of low and medium power, high temperature electronics (up to 500). Ceramic (Al2O3 and AlN) hermetic packages are being used. Die attach techniques based on patterned Au bumps, Au-Si and off-eutectic Au-Sn have been demonstrated. Au thermosonic wire bonding provides a monometallic interconnect system between the die and the package pads. ...
متن کاملDie Attach for High Temperature Electronics Packaging
AuSi, patterned Au and off-eutectic Sn-Au-Sn die attach materials and processes have been investigated for SiC die attach for high temperature applications. AuSi shear test results after 3000 hours of aging at 325C in air showed only a slight decrease in shear strength when assembled on Mo:Mn/Pd/Au metallized AlN. However, when assembled on Mo:Mn/Ni/Au metallized AlN, the die shear strength dec...
متن کاملPackaging Design & Manufacture of High Temperature Electronics Module for 225oC Applications utilizing Hybrid Microelectronics Technology
Many downhole instrumentation tools manufacture today utilizing organic material packaging technology for producing electronic modules. Such approach with organic PCB, standard packaged discrete semiconductor and SMT-type passive components has limited the device operating temperature range in 177oC area. An alternative packaging approach is to utilize Hybrid Microelectronics Technology to incr...
متن کاملStudy of die attach technologies for high temperature power electronics: Silver sintering and gold-germanium alloy
Silver sintering joints and AuGe soldering are promising technologies for high temperature (>200 C ambient) power electronics packaging. This paper presents the implementation of two silver-sintering processes with the one hand micrometer-scale silver particles, and on the other hand nano-meter-scale particles. Two substrates technologies have been investigated: A12O3 DBC and Si3N4 AMB. After t...
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ژورنال
عنوان ژورنال: Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT)
سال: 2013
ISSN: 2380-4491
DOI: 10.4071/hiten-tp15